MG CHEMICALS 860-60G SILICONE HEAT TRANSFER COMPOUND, 60G JAR

MG CHEMICALS 860-60G SILICONE HEAT TRANSFER COMPOUND, 60G JAR


 
Price: CAD $19.19 /Each

Calgary: 10
Saskatoon: 0
On Order with Supplier: 0

Online: In Stock


B&E Part Number: 860-60G
Qty:

  
Description
 
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.

This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

Features & Benefits

  • Thermal conductivity of 0.7 W/(m·K)
  • High dielectric strength
  • Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding heat transfer paste
  • Non-electrically conductive
  • Long service life

Features & Benefits

Thermal conductivity of 0.7 W/(m·K)
High dielectric strength
Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
Excellent corrosion resistance
Non-bleeding heat transfer paste
Non-electrically conductive
Long service life


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