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834FX potting and encapsulating compound is a black,
flexible, flame retardant, thermally conductive two-part epoxy that
offers extreme environmental, mechanical and physical protection for
printed circuit boards and electronic assemblies. This product is
designed for applications where minimizing the physical stress on
components is critical. It is also good in low temperature and arctic
environments, as well as applications that involve temperature cycling
or rapid temperature changes. It provides the functionality of silicone,
but with the durability and cost-effectiveness of epoxy.
It also
provides excellent electrical insulation and protects components from
static discharges, vibration, abrasion, thermal shock, environmental
humidity, salt water, fungus, and many harsh chemicals.
This
epoxy has a convenient 1:1 volume mix ratio, making it compatible with
most dispensing equipment. 834FX can be cured at room temperature or
higher.
Image for illustrative purpose only
Features:
Flexible and high modulus
Meets UL 94V-0 standard—flame retardant
Convenient 1A:1B volume mix ratio
Low exotherm
Low Tg of 0.7 °C (33 °F)
Thermal conductivity of 0.61 W/(m·K)
Good adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
Excellent electrical insulating characteristics
Broad service temperature range -50 to 150 °C (-58 to 302 °F)
Contains non-halogenated flame-retardant fillers
Solvent-free
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